Multilayer PCB has more than 2 conductive copper levels which mainly comprise of inner level cores, prepreg layers and copper foils and they? lso are melted together via heat and strain. Lamination process is among the key to manage good quality of multilayer PCB, this method requires specific heat and pressure for specific durations based on materials accustomed to ensure the PCB board is manufactured properly.

The multilayer PCB is typically the development of the particular double sided PCB with increasing intricacy and density regarding components, they granted the designers to be able to produce highly complex and compact brake lines and further advancement of blind in addition to buried via hole technology has pushed these limits actually further.

With the particular requirements of increased precision in various apps, the demands associated with multilayer PCB retain increasing continuously in recent years. The typical apps of multilayer published circuit boards consist of Computers, Data storage, Cell phone transmission, GPS technology, satellite television systems and thus on.

A-TECH will be an experienced multilayer PCB manufacturer which usually own complete multilayer PCB manufacturing method in house coming from inner layer, vacuum cleaner lamination to surface area finishes, it provides us more benefits in the competitors of global market shares for multilayer printed circuit planks on quality, price and lead period. The proportion associated with multilayer PCB we all manufactured is even more than 65%.

HDI PCB, the entire brand is Very dense Interconnect PCB, it requires much higher wiring thickness with finer search for and spacing, more compact vias and increased connection pad denseness. Blind and hidden vias? design is 1 of their designated feature. multilayer pcb HDI PCB are widely used for Cell phone, tablet computer, digital camera, GPS NAVIGATION, LCD module in addition to other different area.

A-TECH CIRCUITS offers HDI PCB producing services to worldwide customers in the particular top quality automotive industry, medical electronic device industry, mobile, computing and defense industry.

Currently the advanced HDI technology we utilized include: “Direct Laserlight Drill”(DLD) is drilling of copper layer by direct CO2 laser irradiation, compare to additional laser going with conformal mask, the copper immediate laser drilling has the ability to of providing larger accuracy, better hole quality and far better efficiency for HDI projects. “Copper Filled” for special bunch microvia, “Laser Primary Imaging”(LDI) is particularly designed for fine line technology, in order to eliminate dimensional balance problem of artwork caused by ecological and material concerns.

Multilayer PCB Has A lot more Than Two Conductive Copper Layers